Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating

Publisher DOI
Date of Publication
2012
Publication Type
Article
Language(s)
en
Contributor(s)
Hai, N.T.M.
Huynh, T.T.M.
Fluegel, A.
Arnold, M.
Mayer, D.
Reckien, W.
Bredow, T.
Additional Credits
Series
Electrochimica acta
Publisher
Elsevier Science
ISSN
0013-4686
Access(Rights)
metadata.only
Show full item