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  3. Tailored Design of Suppressor Additives for Copper Plating by Combining Functionalities

Tailored Design of Suppressor Additives for Copper Plating by Combining Functionalities

Details
Publisher DOI
10.1149/2.005311eel
Date Issued
2013
Publication Type
Article
Subject(s)
500 Science > 570 Life sciences; biology
500 Science > 540 Chemistry
500 Science
Language(s)
en
Author(s)
Nguyen, Thi Minh Hai  
Departement für Chemie und Biochemie (DCB)  
Janser, Ariane Félice  
Departement für Chemie und Biochemie (DCB)  
Lüdi, Nicola Christian  
Departement für Chemie und Biochemie (DCB)  
Broekmann, Peter  orcid-logo
Departement für Chemie und Biochemie (DCB)  
Additional Credits
Departement für Chemie und Biochemie (DCB)  
Journal
ECS electrochemistry letters
Publisher
Electrochemical Society (ECS)
ISSN
2162-8726
Access(Rights)
metadata.only
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