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  3. Tailored Design of Suppressor Additives for Copper Plating by Combining Functionalities
 

Tailored Design of Suppressor Additives for Copper Plating by Combining Functionalities

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Publisher DOI
10.1149/2.005311eel
Date of Publication
2013
Publication Type
Article
Subject(s)
500 Science > 570 Life sciences; biology
500 Science > 540 Chemistry
500 Science
Language(s)
en
Contributor(s)
Nguyen, Thi Minh Hai
Departement für Chemie und Biochemie (DCB)
Janser, Ariane Félice
Departement für Chemie und Biochemie (DCB)
Lüdi, Nicola Christian
Departement für Chemie und Biochemie (DCB)
Broekmann, Peterorcid-logo
Departement für Chemie und Biochemie (DCB)
Additional Credits
Departement für Chemie und Biochemie (DCB)
Series
ECS electrochemistry letters
Publisher
Electrochemical Society (ECS)
ISSN
2162-8726
Access(Rights)
metadata.only
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