High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures
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BORIS DOI
Publisher DOI
Description
Laser ablation/ionisation mass spectrometry with a vertical resolution at a nanometre scale was applied for the quantitative characterisation of the chemical composition of additive-assisted Cu electroplated deposits used in the microchip industry. The detailed chemical analysis complements information gathered by optical techniques and allows new insights into the metal deposition process.
Date of Publication
2015
Publication Type
Article
Language(s)
en
Contributor(s)
Moreno-García, P. |
Series
Journal of analytical atomic spectrometry
Publisher
Royal Society of Chemistry
ISSN
0267-9477
Access(Rights)
open.access